CMP Slurry Monitor

CMP Slurry Monitor

The CMP Slurry Monitor is used to analyze the characteristics of the slurries used in the Chemical Mechanical Polishing (CMP) of silicon wafers.

The device works fully in-line with the process flow.

The CMP Slurry Monitor uses an electroacoustic sensor for determining size and zeta (the ESA sensor), and a sensor for determining the particle concentration of the slurry.

There are also pH, temperature, pressure and conductivity sensors.

The sensors are managed remotely by a rack-mounted control system which can simultaneously control devices at a number of points throughout the industrial process.

Sensor Diagram

There is also a technical overview of each of the sensors used in the CMP Slurry Monitor.

Technical Product Information

CMP Slurry In-line Monitor Specification (PDF 133Kb, 13 pages)
Provides a detailed technical specification for the CMP Slurry In-line Monitor.

CMP Slurry Monitor Background (PDF 125Kb, 11 pages)
The CMP slurry monitor uses electroacoustic and ultrasonic attenuation measurements to determine the size and zeta potential of slurry particles. The article describes these measurement techniques, and gives some background information on zeta potential.